Wet/Dry Etch Process Overview

SCP004 - 8.00 Hours

Description

    This course is designed for the Semiconductor Processing Industry to provide professional development for a broad audience of employees working for semiconductor manufacturers and suppliers. It is one of a series of overview courses developed to cover process issues for each major semiconductor processing step. This particular course stresses the fundamentals of current processes used in wet/dry etch. While the course is technical in nature it does not focus on specific process related information. It provides a broad overview of the wet/dry etch process and the general principles that are involved. The course also assists participants in understanding in general terms the potential relationship of wet/dry etch to the upstream and downstream processes in the Semiconductor Industry.

This course can be scheduled to meet your specific needs. For more information about this course or to schedule a class for your organization, please contact Knowledge Engineering at (800) 541-7149 or ke@teex.tamu.edu.

Description

    This course is designed for the Semiconductor Processing Industry to provide professional development for a broad audience of employees working for semiconductor manufacturers and suppliers. It is one of a series of overview courses developed to cover process issues for each major semiconductor processing step. This particular course stresses the fundamentals of current processes used in wet/dry etch. While the course is technical in nature it does not focus on specific process related information. It provides a broad overview of the wet/dry etch process and the general principles that are involved. The course also assists participants in understanding in general terms the potential relationship of wet/dry etch to the upstream and downstream processes in the Semiconductor Industry.

Prerequisites

    Semiconductor Processing Overview Course offered through TEEX or course equivalent.

Attendance Requirements

Class attendance is an essential part of the education process and participants in TEEX courses are expected to attend all class sessions and field exercises. This course requires participants to attend a minimum of 80% of the class hours as a component of successful course completion. During the course, your instructor will review any additional attendance requirements, for example a field exercise that cannot be missed.

Topics

Introduction to semiconductor processing steps+Introduction to etching and it's purpose+Introduction to the two types of etching and their uses+Introduction to the two types of etching and their uses+Wet etching processes+Dry (plasma) etching processes+Dry etch of silicon processes+Dry etch of metals and silicides+Dry etch of metals and silicides+Photoresist ashing

Suggested Audience

    All skill levels having an interest in an introduction to the wet/dry etch process and those who require a broad overview of the specific process. This course would assist support staff, equipment operators, entry-level technicians, process and equipment maintenance technicians, entry-level engineers and new hire professional staff in understanding the wet/dry etch process.

Other Information

To have this class taught on site please call customer service at 1-800-541-7149 for more information or email us at ke@teex.tamu.edu

Contact Information

Knowledge Engineering
Phone: (979) 458-6710 | Tollfree: (800) 541-7149

Related Courses

WBT013+WBT020Etch Online Training+Semiconductor Processing Overview (SCPO) - All ModulesEtch Online Training+Semiconductor Processing Overview (SCPO) - All ModulesEtch Online Training+Semiconductor Processing Overview (SCPO) - All Modules

Policies

TEEX Policies
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