The CMP seminar provides an excellent overview of the purpose of CMP, introduction to the common tools and reviews the consumables in the CMP process. Issues related to planarization or polishing of dielectric materials and conductors, post CMP clean-up and metrology are also discussed. Also, issues related to the polishing pad conditioning, techniques used to maintain uniformity, polishing depth and postpolish cleaning are discussed. Download our in-depth course description.
There are no prerequisites for this course.
Class attendance is an essential part of the education process and participants in TEEX courses are expected to attend all class sessions and field exercises. This course requires participants to attend a minimum of 80% of the class hours as a component of successful course completion. During the course, your instructor will review any additional attendance requirements, for example a field exercise that cannot be missed.
TopicsCMP of dielectrics +CMP of metals +Consumables +Equipment fundamentals +Metrology +Post CMP clean-up +Process description +Process parameters
- Experienced wafer fab equipment operators
- Equipment technicians
- Entry-level engineers
- New fab supervisors
- New fab managers
- Professional fab support personnel
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