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Chemical Mechanical Planarization Online Training

WBT012 - 2.00 Hours

Schedule

  • EC  WBT012  134
    $24.95

Description

This module describes the uses of chemical mechanical planarization (CMP), discusses the CMP process, and explains the key quality issues of CMP.

Objectives

At the end of this lesson, the learner will be able to identify:

  • the purpose of CMP in integrated circuit (IC) fabrication
  • the uses of CMP in IC fabrication
  • different methods of CMP
  • the equipment and process parameters that affect CMP
  • different CMP processes
  • the important quality characteristics of CMP

Prerequisite

There are no prerequisites for this course.

Topics

Different CMP processes +Different methods of CMP +The equipment and process parameters that affect CMP +The important quality characteristics of CMP +The purpose of CMP in integrated circuit fabrication +The uses of CMP in IC fabrication

Audience

  • New hires in the semiconductor fab
  • Equipment technicians
  • Wafer fab equipment operators
  • Sales support
  • Entry-level engineers
  • Anyone interested in learning more about the semiconductor industry

Education Credits

    Contact Information

    Knowledge Engineering
    Phone: (979) 458-6710 | Tollfree: (800) 541-7149

    Other Information

    The course fee entitles you to a 90-day subscription during which you can take the course at your own pace. The online course can be taken in sections of your choosing and does not have to be completed during any one session.

    Call (800) 541-7149 for volume discounts and license options for your organization, or email us at ke@teex.tamu.edu

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