WBT013 – 2.00 Hours

Schedule

EC WBT013 144$24.95Register

Address

TEEX-Internet Moodle Campus

Texas A&M University Systems Building
College Station, TX 77845

Instructor

Scott (Richard) Terry

Start Time

12:01 AM Monday, October 01, 2018

EC WBT013 145$24.95Register

Address

TEEX-Internet Moodle Campus

Texas A&M University Systems Building
College Station, TX 77845

Instructor

Scott (Richard) Terry

Start Time

12:01 AM Thursday, November 01, 2018

EC WBT013 147$24.95Register

Address

TEEX-Internet Moodle Campus

Texas A&M University Systems Building
College Station, TX 77845

Instructor

Scott (Richard) Terry

Start Time

12:01 AM Tuesday, January 01, 2019

EC WBT013 148$24.95Register

Address

TEEX-Internet Moodle Campus

Texas A&M University Systems Building
College Station, TX 77845

Instructor

Scott (Richard) Terry

Start Time

12:01 AM Friday, February 01, 2019

This schedule is subject to change without notice. If you have not received confirmation of the class prior to the class start, please contact the division at (800) 541-7149 or ke@teex.tamu.edu to get the latest schedule.

Course Description

This module discusses the uses of etching, describes the kinds of etching and the advantages of each, and explains the key quality characteristics that determine which etching process is best suited to a particular task.

Objectives

At the end of this lesson, the learner will be able to identify:

  • the purpose of etching
  • types of wet etching methods
  • types of dry etching methods
  • advantages and disadvantages of wet etching
  • advantages and disadvantages of dry etching
  • the two quality characteristics and process parameters of wet etching
  • the quality characteristics and process parameters of dry etching
  • quality characteristics of etching

Prerequisites

There are no prerequisites for this course.

Attendance Requirements

To meet attendance requirements, participants must review each training module and complete all required course assignments, activities, quizzes, and/or end of course exam.

Topics

  • Advantages and disadvantages of dry etching
  • Advantages and disadvantages of wet etching
  • Quality characteristics of etching
  • The purpose of etching
  • Two quality characteristics and process parameters of dry etching
  • Types of dry etching methods
  • Types of wet etching methods

Suggested Audience

  • New hires in the semiconductor fab
  • Equipment technicians
  • Wafer fab equipment operators
  • Sales support
  • Entry-level engineers
  • Anyone interested in learning more about the semiconductor industry

Other Information

The course fee entitles you to a 90-day subscription during which you can take the course at your own pace. The online course can be taken in sections of your choosing and does not have to be completed during any one session.

Call (800) 541-7149 for volume discounts and license options for your organization, or email us at ke@teex.tamu.edu

Contact Information

Knowledge Engineering
Phone: (979) 458-6710 | Toll-Free: (800) 541-7149
Email: ke@teex.tamu.edu

Policies

TEEX Policies

This class is a great beginners class and refresher course.

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