Semiconductor Processing Overview
The Semiconductor Processing Overview (SCPO) course is a highly interactive and participative two day (16 hour) basic overview of the theories, principles, and processes of semiconductor manufacturing. Foundation information explores the concepts of measurements, Chemistry, and Physics and their application to the manufacture of integrated circuits (IC’s). Manufacturing processes are divided into three phases that include, but are not limited to the following basic topics:
- Material Preparation and Epitaxial Growth – Czochralski Method and Ingot growth, Grinding, Slicing, Polishing operations.
- Eight wafer fabrication processes – Oxidation, Photolithography, Etch, Chemical Vapor Deposition, Ion Implantation, Diffusion, Chemical Mechanical Planarization, and Metallization.
- Probe, Assembly, and Final Test – Parametric testing, Wafer Probe, Back-grind and Metallization, Assembly (Sawing, Bonding, Encapsulation), Final Test.
Contact Information
Business & Cyber Solutions
Phone: (979) 431-4837
Email: [email protected]
The importance of Quality Control and Microcontamination applications complete and compliment the entire manufacturing process. Within each of the course modules, Equipment descriptions and illustrations, Key Process Parameters, and Key Quality Issues are summarized and discussed.
Target Audience:
Key new hire personnel assigned to TI Wafer Fabs, Lead Manufacturing Specialists, Manufacturing Supervisors, Equipment, Process, and Product Engineering Technicians, Wafer Support Staff that may include Planning and Business Analysts, Facilities personnel, and others that have a desire to understand the basic process of semiconductor manufacturing.
The course number is SCPO15 (Face to Face)
To schedule this course please contact TEEX BCS @ 979-431-4837